Method for producing an electronic component and electronic component

ABSTRACT

A method for producing an electronic component with at least one first electrode zone ( 21 ) and one second electrode zone ( 23 ), which are separated from one another by an insulator ( 9 ) and each comprise at least one sublayer of a first electrically conductive material. Also disclosed is an electronic component, which may be produced using the disclosed method.

RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.13/498,307 filed Jun. 5, 2012 which is a U.S. national stage ofapplication No. PCT/EP2010/063623 filed Sep. 16, 2015 which claimspriority of German Application No.: 10 2009 043 066.0 filed on Sep. 25,2009 and German Application No.: 10 2009 060 066.3 filed on Dec. 22,2009, the disclosure contents of all of which are hereby incorporated byreference.

FIELD OF THE INVENTION

The present invention relates to a method for producing an electroniccomponent and to an electronic component.

BACKGROUND OF THE INVENTION

In electronic components such as organic light-emitting diodesinsulators serve inter alia to separate two electrode zones from oneanother. Suitable insulators such as for example photosensitive lacquersare generally very expensive and difficult to apply.

SUMMARY OF THE INVENTION

An object of the present invention is to provide a method improved overthe prior art for producing an electronic component, in which theinsulator is applied only to specific zones of an electricallyconductive layer.

A method according to an embodiment of the invention is suitable forproducing an electronic component with at least one first electrode zoneand one second electrode zone, which are separated from one another byan insulator and each comprise at least one sublayer of a firstelectrically conductive material.

The method according to an embodiment of the invention comprises thefollowing steps:

A) providing a substrate layer and at least one first electricallyconductive layer of the first electrically conductive material arrangedon the substrate layer;

B) arranging at least one second electrically conductive layer of asecond electrically conductive material on the first electricallyconductive layer;

C) arranging at least one first insulator on the substrate, such thatthe second electrically conductive layer comprises at least one firstsubzone, which is covered with the insulator, and a second subzone,which is not covered with the insulator, the insulator being arrangedsuch that it may serve to separate the first electrode zone and thesecond electrode zone from one another; and

D) arranging at least one functional layer and at least one secondelectrode layer on the second electrically conductive layer obtained inthe preceding step, which is covered in places with the insulator.

The term “electrode zone”, as used herein, denotes a zone or portion,functioning as an electrode, of the electronic component or of anelectrode layer thereof. The electrode layer may be an anode layer or acathode layer.

The first and second electrode zones each comprise at least one sublayerof a first electrically conductive material. The term “electricallyconductive material”, as used herein, denotes a material or a substancewith the ability to conduct electrical current. The term “sublayer of afirst electrically conductive material”, as used herein, means that theelectrode zones each comprise or consist of a portion formed as a layerof the first electrically conductive material. The sublayer formed ofthe first electrically conductive material is in this case clearlyseparated from possible further layers, such that for example theformation of an alloy between the first electrically conductive materialand each further material applied in the respective electrode zone isruled out.

The term “insulator”, as used herein, denotes an insulating substancewhich is applied such that it prevents current flow between the firstelectrode zone and the second electrode zone. The insulator may be acoating or a coating composition, such as a polymer or the like, and inparticular a lacquer and the like.

The term “lacquer” should here be taken to mean a coating materialapplicable in liquid or indeed in powder form.

The phrase “first electrically conductive layer”, as used herein,denotes a layer comprising the first electrically conductive material ora layer consisting of the first electrically conductive material, whichis deposited directly on the substrate layer. The first electricallyconductive layer may be a transparent conductive layer. Without beinglimited thereto, it may be formed of a transparent conductive oxide(TCO), for example indium-doped tin oxide (ITO) or ZnO, In/ZnO, SnZnO,Al—ZnO and the like. The first electrically conductive layer may beapplied to the substrate layer for example by means of sputtering.

A second electrically conductive layer of a “second electricallyconductive material” is deposited on the first electrically conductivelayer, which material is conventionally different from the firstelectrically conductive material. For example, the first electricallyconductive material may be provided in particular for the anode of thefinished device, the second electrically conductive material beingprovided for the cathode or vice versa. Examples of the secondelectrically conductive material include, without being limited thereto,metals, for example aluminium, barium, indium, copper, silver, gold,magnesium, calcium and lithium and the like and mixtures or combinationsthereof, in particular in the form of alloys with one another or withother metals. The second electrically conductive layer may comprise justone or indeed a plurality of sublayers. The individual sublayers maythen mutually independently each consist of or contain the above-statedmaterials; in addition to the metals listed explicitly above, they mayalso contain or consist of the metals chromium and molybdenum. Examplesof layer sequences in a second electrically conductive layer comprisinga plurality of sublayers are Mo/Al/Mo, Cr/Al/Cr, Cu/Cr and Cr/Cu.

The second electrically conductive layer may be applied by means ofsputtering, physical vapour deposition (PVD) or the like to the firstelectrically conductive layer.

The term “substrate layer”, as used herein, denotes a layer of asubstrate as is conventionally used for example in the prior art for anelectronic component. The substrate may be a transparent or anon-transparent substrate. For example, the substrate may compriseglass, quartz, sapphire, plastics films, coated plastics films, metal,metal foils, films coated with an electrically insulating layer, siliconwafers or any other suitable substrate material. According to theinvention, the substrate layer is in particular taken to mean the layeron which all the other layers are subsequently applied during productionof the electronic component. In the case for example of an opticalelectronic component, for example a radiation-emitting device, suchsubsequent layers may be layers required for radiation emission.

The “second electrode layer” may comprise a material or be formed of amaterial which is selected from metals such as aluminium, barium,indium, silver, gold, magnesium, calcium and lithium and combinationsthereof or a compound thereof, in particular an alloy, as well astransparent conductive oxides, such as for example metal oxides, such aszinc oxide, tin oxide, cadmium oxide, titanium oxide, indium oxide orindium-doped tin oxide (ITO), aluminium-doped zinc oxide (AZO), Zn₂SnO₄,CdSnO₃, MgIn₂O₄, GaInO₃, Zn₂In₂O₅ or In₄Sn₃O₁₂ or mixtures of differenttransparent conductive oxides. The second electrode layer is preferablyformed of a metal. The second electrode layer of the electroniccomponent may be a cathode layer.

A “functional layer” of the electronic component performs a functionwhich is characteristic of the electronic component. For example,functional layers may be radiation-emitting layers, such as fluorescentand/or phosphorescent emitter layers of an organic light-emitting diode.

An “electronic component”, which may be produced using the methodaccording to the invention, may, without being limited thereto, be atransistor, a capacitor, a thermistor, an organic electronic component,such as an organic light-emitting diode, a solar cell, and the like.

It is possible, with the method according to an embodiment of theinvention, to separate two electrode zones from one another, whereinstructuring of the electrode zones takes place at a preselected positionduring application of the electrode zones or subsequently and theinsulator applied to the second electrically conductive layer isarranged in the zone formed by the structuring. The structuring isconventionally introduced later.

If the structuring is already present (i.e. introduced “earlier”), thismay take place by applying the first and second electrically conductivelayers or subzones thereof to the substrate for example by printing, bydeposition using SAMs (self assembling monolayers) and the like.

The insulator is applied (conventionally exclusively) to the secondelectrically conductive layer. Provision is made according to theinvention for the insulator to be applied to the second electricallyconductive layer only in predetermined zones or portions.

Arranging the insulator only in the first subzone of the secondelectrically conductive layer may be performed, depending on thecomposition of the insulator, by means of a printing process, with theassistance of a syringe, nozzle, grommet and the like. After completionof the electronic component, the first subzone may serve as a bond pador as a bus bar for subsequent contacting of the electronic component.

The second electrically conductive layer is subdivided by means of theinsulator applied to the substrate into at least two subzones, of whichone is covered with insulator and the other is not covered. At the sametime, the insulator is arranged such that it may serve to separate thefirst and the second electrode zones of the first electricallyconductive layer from one another. This should in particular also betaken to mean that in a later method step the insulator is madedeformable, which makes it possible to arrange the insulator in such away that the electrode zones are separated from one another by theinsulator.

The method according to an embodiment of the invention of producing anelectronic component may be used to produce electronic components moreeconomically with regard to cost and time. Since each layer of thecomponent is applied individually and may optionally, as desired orrequired, be structured (as may be inferred from the following furtherdevelopments of the method), complex coating or application steps maythus be avoided and (often expensive) material may additionally besaved.

By applying the second electrically conductive layer according to theinvention extensively on the first electrically conductive layer, it isadditionally possible to prevent the first electrically conductivelayer, such as for example a sensitive ITO layer, from coming intocontact with the insulator to be printed on and/or the protectivematerial and possibly being damaged or impaired. In addition, the firstelectrically conductive layer does not come into direct contact with theinstallations. The first electrically conductive layer may additionallyin particular be free of particles, such as contaminants, since etchingof the second electrically conductive layer removes contaminants, suchas residues, which may arise through redeposition of an optionallyperformed laser ablation process.

The method according to an embodiment of the invention makes it possibleto achieve “self aligning” of the second electrically conductivematerial and of the insulator. In this way it is for example possible toprovide conductor tracks or bond pads, simply and easily in theelectronic component produced according to the invention.

In a further development of the method according to the invention, themethod comprises the following step:

E) removing first electrically conductive material of the firstelectrically conductive layer at least along a predetermined separationzone between the first electrode zone and the second electrode zone.This removal step can be performed after step A) and before step B).

The predetermined separation zone may be a sort of trench or gap betweenthe first and second and any further electrode zone of the firstelectrically conductive layer formed by removing the first electricallyconductive material.

It is alternatively possible to remove both the first electricallyconductive material of the first electrically conductive layer and thesecond electrically conductive material of the second electricallyconductive layer, located over the first electrically conductivematerial, at least along a predetermined separation zone between thefirst electrode zone and the second electrode zone (step F)).

This step is normally performed after step B) and before step C).

Removal of both the first and second electrically conductive materialmay in this case proceed preferably simultaneously, i.e. in one step.

In a further development of the method according to the invention, themethod according to the two above alternatives comprises removal of thefirst electrically conductive material (step E) or removal of the firstelectrically conductive material and of the second electricallyconductive material (step F)) by means of laser ablation.

The term “laser ablation”, as used herein, covers the removal of thefirst electrically conductive material or the removal of the first andof the second electrically conductive materials from the surface of thesubstrate layer by bombardment with pulsed laser radiation.

During removal or erosion of the second electrically conductive layerand the first electrically conductive layer by means of laser ablation,in particular only the uppermost, i.e. the second electricallyconductive layer heats up. This may be particularly advantageous when itcomes to protecting the first electrically conductive layer, for examplean ITO layer, which is generally a very sensitive layer.

In a further development of the method according to the invention, themethod additionally comprises the step G) of arranging at least oneprotective material in at least one third subzone of the secondelectrically conductive layer, which is arranged in the second subzone.

The term “protective material”, as used herein, denotes a material or asubstance which serves to protect the second electrically conductivematerial of the second electrically conductive layer in the subzones inwhich it has been applied to the second electrically conductive layer,in particular in the further procedure of producing the electroniccomponent, i.e. in further process steps.

The protective material may be a coating material such as a lacquer andthe like. In particular, the protective material may be analkali-soluble etching resist, for example an etching resist as used inthe production of printed circuit boards (PCBs). This etching resist maybe crosslinked or cured thermally or by means of UV radiation. Theprotective material is preferably soluble in a solvent in which theinsulator is insoluble. Mention may be made in this regard for instanceof alkaline solutions for example weak alkaline aqueous solutions ofsalts inter alia (for example NaOH, KOH, NH₄OH, or quaternary ammoniumsalts as N(CH₃)₄OH).

Arrangement of the protective material may take place both afterapplication of the second electrically conductive layer to the firstelectrically conductive layer and before application of the insulator tothe second electrically conductive layer and after application of theinsulator to the second electrically conductive layer and beforeapplication of a functional layer to the second electrically conductivelayer.

Application of the protective material proceeds in such a way that thesecond electrically conductive layer is covered with protective materialin the third subzone and in at least one fourth subzone, which isarranged in the second subzone, is not covered with the protectivematerial nor with the insulator.

The protective material may be arranged, at least in places, over or onthe insulator.

In a further development of the method according to the invention, theprotective material is arranged at a distance from the insulator on thesecond subzone, such that a gap remains between the first subzone andthe third subzone. In this embodiment the protective material is notarranged on the insulator.

The “distance” at which the protective material is arranged on theinsulator may be a predetermined distance. The “gap” which is producedby arranging the protective material spaced from the insulator may be azone which corresponds to the separation zone or the separating linebetween the first and second electrode zones.

According to this further development of the method according to theinvention, at least some of the first electrically conductive materialof the first electrically conductive layer and of the secondelectrically conductive material of the second electrically conductivelayer, located in the zone of the gap, as described above, is removed.The first electrically conductive material to be removed of the firstelectrically conductive layer and the second electrically conductivematerial of the second electrically conductive layer are normallylocated under the gap.

In a further development of the method according to the invention forproducing the electronic component, the method comprises the followingstep:

H) at least partial removal of the second electrically conductive layerin at least the fourth subzone.

This step H) may proceed both after step C) and before step D) as wellas after step G) and before step D).

The second electrically conductive material is in this case removedsubstantially in the fourth subzone of the second subzone, i.e. in thatzone which is covered neither by protective material nor by insulator.By removing second electrically conductive material, the firstelectrically conductive layer located under the second electricallyconductive layer is exposed in the zone of the fourth subzone of thesecond electrically conductive layer (and not removed). Removal thusproceeds by means of a method which selectively removes just one layer,for example a metal layer.

In a further development of the method according to the invention forproducing the electronic component, the second electrically conductivelayer is removed by etching. Etching of the second electricallyconductive material may in this case proceed using an etching bath.

The term “etching”, as used herein, denotes removal of the secondelectrically conductive material on the surface of the firstelectrically conductive layer by applying suitable etching substances;these may be chemical substances which modify (generally oxidise) thematerial to be removed in a chemical reaction and thus generallydissolve it. Etchants are normally acids or strong oxidising agents.Examples worthy of mention are HNO₃, HCl, H₃PO₄, acetic acid, H₂SO₄,cerium ammonium nitrate (CAN) and H₂O₂.

In such an embodiment both the insulator and the protective material areresistant to the chemicals, such as for example acids, used for etchingthe second electrically conductive material. In the zones of the secondelectrically conductive layer on which they are applied, the insulatorand the protective material provide an etch stop function for the secondelectrically conductive layer or the second electrically conductivematerial in the corresponding zones of the second electricallyconductive layer. In addition, the etching bath is selected such thatthe first electrically conductive layer, for example a sensitive ITOlayer, is not attacked or impaired by the etchant used.

By etching the second electrically conductive material, the structuresof the first electrically conductive layer and the second electricallyconductive layer located under the insulator and/or under the protectivematerial layer are maintained.

An advantage of the method according to an embodiment of the inventionmay consist in just one individual etch step being required to removethe second electrically conductive material in the fourth subzonearranged in the second subzone of the second electrically conductivelayer and thus to expose parts of the first electrically conductivelayer as the first and second electrode zones.

In a further development of the method according to the invention, themethod comprises the following step:

I) removing the protective material from the second electricallyconductive layer.

Removal of the protective material from the second electricallyconductive layer in this case takes place after step H).

Since the insulator is only applied at specific, previously determinedpoints on the second electrically conductive layer, in the methodaccording to the invention an electrically non-conductive material, theprotective material, has optionally to be removed just once. Theprotective material used may generally be removed with the assistance ofa suitable solvent, instead, as may be conventional in the prior art, ofby means of etching.

The protective material may for example also be removed by means ofstripping. The term “stripping” in this case denotes ashing or removalof protective material, such as for example of a (photo)resist. As arule, an oxygen plasma is in this case used in the “stripper” or asher,to burn off the (photo)resist.

By removing the protective material from the second electricallyconductive layer, second electrically conductive material is completelyexposed. The exposed zones of the second electrically conductive layermay be used as the second electrode of the electronic component. Theymay form part of the second electrode or serve wholly as the secondelectrode.

In a further development of the method according to the invention, theinsulator is applied directly on the second electrically conductivelayer and arranged on the second electrically conductive layer such thatit is located in the immediate vicinity of the separation zone betweenthe first electrode zone and the second electrode zone. The term “in theimmediate vicinity” means that the insulator is applied spatially to thesecond electrically conductive layer in such a way that it is capable,as the result of subsequent treatment such as for example softening, offlowing into the separation zone between the first electrode zone andthe second electrode zone. For example, the insulator may be arranged insuch a way that its distance from the separation zone is no greater thanthe width of the separation zone.

The insulator may be applied to the second electrically conductive layerin a predetermined pattern. Such a pattern may, for example, bepredetermined by means of coordinates or the like before application ofthe insulator. The insulator may be applied to the second electricallyconductive layer by means of a mask or a stencil or defined coordinates,which are applied to the surface of the second electrically conductivelayer as a reference system.

By applying the insulator and the protective material at specific pointsby means of a printing process, it is additionally possible to reduce orrule out the risk of errors caused by incorrect orientation of thephotolithographic installation during application of the photosensitivelacquers.

In a further development of the method according to the invention, theinsulator is in this case applied to the second electrically conductivelayer by means of a printing method. Suitable printing process includeplanographic, relief, intaglio and screen printing processes andcombinations thereof. The insulator may in particular be printed ontothe second electrically conductive layer by screen printing, ink-jetprinting, flexographic printing and the like. Further suitable printingprocess include pad printing, stamp printing process, pochoir and thelike.

The protective material may, like the insulator, also be printed on thesecond electrically conductive layer. The above-stated explanationsrelating to suitable printing process therefore likewise apply toprinting of the protective material.

With the method according to an embodiment of the invention it isadvantageously possible, by printing on the insulator and the protectivematerial, to make savings both on material and time and thus on costsover the methods conventionally used in the prior art, such as forexample lithographic methods.

In contrast to the lithographic methods used conventionally, in whicheach coating step is individually applied and structuredphotolithographically, in the method according to the invention onlythat quantity of material of the insulator and of the protectivematerial, which may as a rule both be expensive materials, is appliedwhich is needed to produce the electronic component. In this way OLEDtiles, which are complex and expensive to produce by conventionalmethods, may advantageously be produced in a time- and material-savingmanner.

Since simple lacquers may be used in the method according to anembodiment of the invention as the insulator and/or protective material,it is additionally advantageously possible to dispense with the use ofexpensive chemicals, such as for example photosensitive lacquers, whichare generally used in photolithographic methods. Since according to theinvention no subsequent structuring of the individual layers isnecessary, it is additionally advantageously possible to dispense withexpensive installations.

In a further development of the method according to the invention, themethod includes the step J) of establishing conditions in which theinsulator may be brought at least partially into a flowable state andthe step K) of introducing the insulator or allowing it to flow into atleast one portion of the separation zone between the first electrodezone and the second electrode zone.

The insulator is in this case in particular a liquefiable insulator,such as for example a polymer or a lacquer. To be able to liquefy theinsulator, one or more of the following conditions, temperatureincrease, pressure, light, reagents, vapour and the like, may beestablished as conditions for liquefaction of the insulator. If thematerial is selected suitably, the insulator may soften as a result ofheating of the substrate layer or direct exposure of the secondelectrically conductive layer to radiant heat. The insulator may thenflow over the edges of the second electrically conductive layer and/orthe first electrically conductive layer. In addition, the insulator maybe softened by being introduced into a solvent atmosphere, for examplewater, or indeed a lower-boiling solvent. In this way the structure ofthe insulator may advantageously be rounded.

In a further development, the method is such that at least one conductortrack of the second electrically conductive material is arranged on thefirst electrically conductive layer in the first electrode zone.

In the finished electronic component it is clearly discernible both withthe naked eye and under a microscope that the insulator has been printedon. At the edges undulating or fissured structures are in each casevisible, which do not occur when a photolithographic method is used(clear straight line).

The method according to an embodiment of the invention does notconventionally include any photolithographic steps and an economicmethod may therefore be used to produce an electronic component, such asfor example an organic light-emitting diode. It is possible, by means ofthe method according to the invention, to produce an electroniccomponent of robust design. The method according to the invention maytherefore also be used to mass-produce electronic components.

All in all, the method according to the invention may thus provide ahighly cost-effective method, for example for producing OLED tiles.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the present invention are hereinafter illustrated withreference to the figures without restricting its general nature. Similaror identical elements are labelled with the same reference signs in thefigures, in which:

FIGS. 1 A-I illustrate a method of producing an electronic componentaccording to a first embodiment of the present invention;

FIGS. 2 A-I illustrate a method of producing an electronic componentaccording to a second embodiment of the present invention; and

FIG. 3 shows a plan view onto a substrate template.

DETAILED DESCRIPTION OF THE DRAWINGS

FIGS. 1A to I show preparation of a substrate for the production of anelectronic component using the method of the invention according to afirst embodiment.

A substrate layer 1 (see FIG. 1A) may for example be formed of glass.Alternatively, the substrate layer 1 may also be formed of plasticsfilms, coated plastics films, metal foils, which are for example coatedwith an electrically insulating layer, and the like.

Processing begins with extensive coating of the substrate layer 1 with afirst electrically conductive layer 3 (see FIG. 1B).

The first electrically conductive layer 3 may for example be atransparent layer of ITO. Alternatively, the first electricallyconductive layer 3 may also be formed of another transparent electricalmaterial, such as for example ZnO, In/ZnO, SnZnO, Al—ZnO or anothersuitable material, which is designed to withstand the process of etchingthe second electrically conductive material.

Coating may for example proceed by means of sputtering.

In the next step the first electrically conductive layer 3 is coatedextensively with a second electrically conductive layer 5 (see FIG. 1C).In this case, a metal may be used as the second electrically conductivematerial for the second electrically conductive layer 5. However manyother metals and combinations thereof are possible. The secondelectrically conductive layer 5 may be deposited by means of sputtering,PVD and the like.

As shown in FIG. 1D, laser ablation then takes place, which produces aseparation zone 7 or a trench in the second electrically conductivelayer 5 and the first electrically conductive layer 3. The separationzone 7 provides the subsequent electrical insulation between the cathodeand the anode of the electronic component.

In the next step, as shown in FIG. 1E, an insulator 9 is applied instructured manner to the second electrically conductive layer 5, suchthat at least one first subzone 11 is produced, which is covered withthe insulator 9, and at least one second subzone 13, which is notcovered with the insulator.

The insulator 9 may be a lacquer. It may be applied to the secondelectrically conductive layer 5 by a printing process, such as forexample screen printing, ink-jet printing or flexographic printing. Theinsulator 9 should be selected such that it is softenable by subsequenttreatment and may be brought into a flowable state.

The function of the insulator 9 is primarily electrical insulation inthe subsequent electronic component and the etch stop function of thesecond electrically conductive layer 5.

Next, a protective material 15 is applied to the second electricallyconductive layer 5 (see FIG. 1F), which may or may not partially coverthe insulator 9. The second electrically conductive layer 5 thencomprises a third subzone 17, which is covered with protective material15, and a fourth subzone 19, which is not covered with protectivematerial.

The protective material 15 may be a lacquer. The protective material 15is preferably soluble in a solvent, in which the insulator 9 isinsoluble or is at least only sparingly soluble.

The protective material 15 may be applied to the second electricallyconductive layer 5 by a printing process, such as for example screenprinting, ink-jet printing or flexographic printing. The function of theprotective material 15 is in particular an etch stop function for thesecond electrically conductive layer 5.

As shown in FIG. 1G, next comes removal of the second electricallyconductive material of the second electrically conductive layer 5,etching preferably being used. For etching of the second electricallyconductive layer 5 an etching bath, such as for example 3%trichloroacetic acid in water is used. In this case the metal structuresof the second electrically conductive layer 5 of the fourth subzone 19are removed, while those of the first subzone 11 and of the thirdsubzone 17 are substantially retained.

In step I) the protective material 15 (in FIG. 1H the protectivematerial is therefore no longer shown) is removed using a solvent.

The substrate layer 1 or the insulator 9 is then heated directly suchthat the insulator 9 softens (reflow) and flows over the exposed edgesof the second electrically conductive layer 5 and the first electricallyconductive layer 3. As shown in FIG. 1I, the structure of the insulator9 is rounded.

On the substrate layer prepared in this way it is now possible toproduce the electronic component, for example an OLED, by a conventionalmethod. To this end, in subsequent processing steps the semiconducting,light-generating organic layers and the second electrode layer, forexample a cathode layer, are applied to the substrate layer under avacuum by vapour deposition.

FIGS. 2A to I show preparation of a substrate for the production of anelectronic component using the method of the invention according to asecond embodiment.

The second embodiment corresponds substantially to the first embodiment,except that laser ablation of the first electrically conductive layer 3and the second electrically conductive layer 5 proceeds afterapplication of the insulator 9 and of the protective material 15: afterextensive application of the second electrically conductive layer 5 tothe first electrically conductive layer 3, the insulator 9 is applied tothe second electrically conductive layer 5 by a printing process (seeFIG. 2D), such that a first subzone 11 with insulator 9 is present.

The protective material 15 is then applied to the second electricallyconductive layer 5 (see FIG. 2E), such that a third subzone 17 iscovered with protective material 15.

Then, as illustrated in FIG. 2F, laser ablation is performed, by meansof which the separation zone 7 is produced in the second electricallyconductive layer 5 and in the first electrically conductive layer 3.Such a separation zone 7 may for example provide subsequent electricalinsulation between cathode and anode of the electronic component.

In this case the laser cut should extend in a gap between the insulator9 and the protective material 15. Furthermore, the laser cut shouldextend so close to the edge of the insulator 9 that, in the process stepof softening the insulator 9, the insulator 9 flows over the edgeproduced by the laser of the second electrically conductive layer 5 andthe first electrically conductive layer 3.

The method then continues with the removal in turn of the secondelectrically conductive material in the fourth subzone 19 of the secondelectrically conductive layer 5 (see FIG. 2G), which removes protectivematerial (see FIG. 2H), the insulator 9 is brought into a flowable stateand introduced into the separation zone 7 (see FIG. 2I) and theremaining layers of the electronic component are deposited on thesubstrate layer prepared in this way (not shown).

It is alternatively also possible to structure the first electricallyconductive layer by means of laser ablation and then to apply secondelectrically conductive material to zones of the first electricallyconductive layer or extensively to the first electrically conductivelayer, such that second electrically conductive material is introducedinto the gaps produced by structuring of the first electricallyconductive layer. The structuring of the first electrically conductivelayer may then be re-exposed subsequently, by arranging the insulatorand the layer material in such a way that in the etching process secondelectrically conductive material is removed in the zone in whichtrenches or the like were introduced into the first electricallyconductive layer.

If the second electrically conductive layer and the first electricallyconductive layer are jointly structured, any deposits or contaminantsarising during the ablation process may be removed. Such a procedure mayresemble the cleaning of silicon wafers and advantageously constitute avery clean process. It may alternatively also be advisable for the laserto cut through the insulator, the second electrically conductive layerand the first electrically conductive layer, such that on softening(reflow) of the insulator the insulator may fill the separation zonefrom both sides.

FIG. 3 shows a plan view of a prepared substrate layer 1 for producingan electronic component.

On its top the substrate layer 1 comprises a first electrode zone 21 anda second electrode zone 23, which are insulated from one another by theinsulator 9.

A conductor track 25 is provided in the middle of the substrate templateshown in FIG. 3. Feed lines 27 are arranged for electrical contacting ofthe component.

1. A method for producing an electronic component with at least onefirst electrode zone and one second electrode zone, which are separatedfrom one another by an insulator and each comprise at least one sublayerof a first electrically conductive material, comprising the steps: A)providing a substrate layer and at least one first electricallyconductive layer of the first electrically conductive material arrangedon the substrate layer; B) arranging at least one second electricallyconductive layer of a second electrically conductive material on thefirst electrically conductive layer; C) arranging at least one firstinsulator on the substrate, such that the second electrically conductivelayer comprises at least one first subzone, which is covered with theinsulator, and a second subzone, which is not covered with theinsulator, the insulator being arranged such that it may serve toseparate the first electrode zone and the second electrode zone from oneanother; D) arranging at least one functional layer and at least onesecond electrode layer on the second electrically conductive layerobtained in step C), which is covered in places with the insulator; J)establishing conditions in which the insulator may be brought at leastpartially into a flowable state; and K) introducing the insulator intoat least one portion of the separation zone between the first electrodezone and the second electrode zone.
 2. A method according to claim 1,wherein the electronic component is an organic light-emitting diode, andwherein the functional layer is an organic fluorescent or phosphorescentemitter layer.
 3. A method according to claim 1, wherein the insulatoris a lacquer and is applied to the second electrically conductive layerby screen printing, ink-jet printing or flexographic printing, afunction of the insulator is an etch stop function of the secondelectrically conductive layer.
 4. A method according to claim 1, furthercomprising the step: G) arranging at least one protective material in atleast one third subzone, which is arranged at least partially in thesecond subzone and also in the first subzone atop the protective layer,such that the second electrically conductive layer in at least onefourth subzone, which is arranged at least partially in the secondsubzone, is not covered with the protective material.
 5. A methodaccording to claim 4, wherein in a step I) the protective material isremoved using a solvent in which the insulator is insoluble, theinsulator is not affected by removing the protective material, step I)is done before step J).
 6. A method according to claim 1, wherein instep J) the insulator is softened by heating flows over exposed edges ofthe second electrically conductive layer and the first electricallyconductive layer, a structure of the insulator is rectangular beforestep J) and becomes rounded in step J) when seen in cross-section.
 7. Amethod according to claim 1, further comprising the step: E) removingfirst electrically conductive material of the first electricallyconductive layer along a predetermined separation zone between the firstelectrode zone and the second electrode zone, the separation zone hasthe form of a trench and in the separation zone the substrate layer isexposed, wherein in step C) the trench is completely covered but notfilled with the insulator and in step J) the trench becomes completelyfilled with the insulator, step E) taking place between step A) and stepB).
 8. A method according to claim 1, further comprising the step: F)removing first electrically conductive material of the firstelectrically conductive layer and second electrically conductivematerial of the second electrically conductive layer, located over thefirst electrically conductive material, at least along a predeterminedseparation zone between the first electrode zone and the secondelectrode zone, the separation zone has the form of a trench which isnot covered with the insulator prior to step J) and becomes completelyfilled with the insulator in step J).
 9. A method according to claim 8,wherein the protective material is arranged at a distance from theinsulator on the second subzone, such that a gap remains between thefirst subzone and the third subzone, and wherein at least some of thefirst electrically conductive material of the first electricallyconductive layer and of the second electrically conductive material ofthe second electrically conductive layer, located in the zone of thegap, is removed according to step F), the gap corresponds to the trenchand is completely filled with the insulator in step J).
 10. A methodaccording to claim 1, wherein the first electrically conductive materialis a transparent conductive oxide.
 11. A method according to claim 10,wherein the second electrically conductive material is a metal.
 12. Amethod according to claim 5, which is performed in such a way that atleast one conductor track of the second electrically conductive materialis arranged on the first electrically conductive layer in the firstelectrode zone.
 13. An electronic component, produced by a methodaccording to claim 1.